Manufacturing method for electronic devices

A manufacturing method for an electronic device joining a first metallic bond part formed on a first electronic component and a second metallic bond part formed on a second electronic component, the manufacturing method comprising:

• a first process for:
• placing the first metallic bond part directly against the second metallic bond part;
• applying pressure to the first electronic component and the second electronic component;
• metallically joining the first metallic bond part to the second metallic bond part;
• and
• releasing the applied pressure;
• and
• a second process for:
• heating the first electronic component and second electronic component at a predetermined temperature so that the first metallic bond part and the second metallic bond part are joined to each other,
• wherein the first electronic component or the second electronic component includes a semiconductor substrate and, the second metallic bond part mounted on the semiconductor substrate,
• wherein the second metallic bond part includes a base section and a cover section covering a surface of the base section with a melting point lower than that of the base section,
• wherein in the first process, the first electronic component and the second electronic component are heated and maintained at a temperature lower than the melting point of the cover section, and
• wherein in the second process, the first electronic component and the second electronic component are heated and maintained at a temperature higher than the melting point of the cover section.