Electrochemical device and manufacturing method thereof, circuit board and housing tray
AssigneeTDK Corporation
InventorsHiroaki HASEGAWA, Hidetake ITOH, Yoshihiko OHASHI, Kazuo KATAI, Yosuke MIYAKI
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Abstract
A lead 3 of an electrochemical device includes a lead body 3A containing Al, and a bent metallic thin film 3a provided to a tip part of the lead body 3A. The metallic thin film 3a includes a thin film body 3a1 containing Ni, and a plating layer 3a2 containing Sn and covering at least an outer surface of the bent thin film body 3a1. A specific area of an inner surface of the bent thin film body 3a1 and a surface of the lead body 3A are welded in a predetermined area without the plating layer 3a2 being disposed there between.
Claims42
An electrochemical device including a charger/discharger housed in an outer package, and a lead extending from the charger/discharger, wherein
- the lead has:
- a lead body containing Al;
- and
- a metallic thin film which is provided to a tip part of the lead body, and which is bent at a side face position of the lead body as a boundary, and covers upper and lower faces and a side face of the lead body, and in which a predetermined area is welded to the lead body,
- the metallic thin film includes:
- a thin film body containing Ni;
- and
- a plating layer containing Sn and covering at least an outer surface of the bent thin film body, and wherein
- a specific area of an inner surface of the bent thin film body and a surface of the lead body are directly in contact and welded in the predetermined area without the plating layer being disposed therebetween.
An electrochemical device including a charger/discharger housed in an outer package, and a lead extending from the charger/discharger, wherein
- the lead has:
- a lead body containing Al;
- and
- a metallic thin film which is provided to a tip part of the lead body, and which is bent at a side face position of the lead body as a boundary and covers upper and lower faces and a side face of the lead body, and in which a predetermined area is welded to the lead body,
- the metallic thin film includes:
- a thin film body containing Ni;
- and
- a plating layer containing Sn and covering at least an outer surface of the bent thin film body, and wherein
- a specific area of an inner surface of the bent thin film body and a upper face of the lead body are directly in contact and welded in the predetermined area without the plating layer being disposed therebetween, and a lower face of the lead body is not welded to the thin film body.
An electrochemical device including a charger/discharger housed in an outer package, and a lead extending from the charger/discharger, wherein
- the lead has:
- a lead body containing Al;
- and
- a metallic thin film which is provided to a tip part of the lead body, and which is bent into a curved shape at a side face position of the lead body as a boundary so as to form a gap between a side face of the lead body and the metallic thin film, and moreover which covers upper and lower faces and a side face of the lead body, and in which a predetermined area is welded to the lead body,
- the metallic thin film includes:
- a thin film body containing Ni;
- and
- a plating layer containing Sn and covering at least an outer surface of the bent thin film body, and wherein
- a specific area of an inner surface of the bent thin film body and a surface of the lead body are directly in contact and welded in the predetermined area without the plating layer being disposed therebetween.
An electrochemical device including a charger/discharger housed in an outer package, and a lead extending from the charger/discharger, wherein
- the lead has:
- a lead body containing Al;
- and
- a metallic thin film which is provided to a tip part of the lead body, and is bent so as to cover a lower face and a side face of the lead body, and in which a predetermined area is welded to the lead body,
- the metallic thin film includes:
- a thin film body containing Ni;
- and
- a plating layer containing Sn and covering at least an outer surface of the bent thin film body,
- a specific area of an inner surface of the bent thin film body and a surface of the lead body are directly in contact and welded in the predetermined area without the plating layer being disposed therebetween, and wherein
- the lead is bent so as to incline in an obliquely downward direction from a position which is in contact with the outer package.
Dependencies are inferred from the claim text.