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US 2011/0253434 A1Published application
Epoxy resin composition, and prepreg and printed circuit board using the same
OwnerHsien-Te CHENinventor
Life of this patent
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Abstract
Disclosed is an epoxy resin composition for printed circuit board, which includes (A) an epoxy resin; (B) a composite curing agent, including an amino-triazine-novolac resin and dicyandiamide mixed in a certain proportion; (C) a curing accelerator; and (D) an optional inorganic filler.
Claims14
An epoxy resin composition, comprising:
- (A) an epoxy resin having at least two epoxy groups in one molecule;
- and
- (B) a composite curing agent comprising 30 to 50 parts by weight of an amino-triazine-novolac resin, and 0.1 to 8 parts by weight of dicyandiamide, based on 100 parts by weight of the epoxy resin.
Dependencies are inferred from the claim text.