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US 2011/0253422 A1Published application
Wiring board and method of manufacturing the same
AssigneeShinko Electric Industries Co., Ltd.
InventorsShigetsugu Muramatsu, Yasuhiko Kusama
Life of this patent
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Abstract
A wiring board includes: an uppermost wiring layer formed on a prescribed number of underlying wiring layers, a portion of the uppermost wiring layer being exposed and used as a pad for connection with a component to be mounted; and an insulation resin layer covering the uppermost wiring layer, wherein the thickness of the portion of the uppermost wiring layer is larger than that of other portions thereof.
Claims5
A wiring board comprising:
- an uppermost wiring layer formed on a prescribed number of underlying wiring layers, a portion of said uppermost wiring layer being exposed and used as a pad for connection with a component to be mounted;
- and
- an insulation resin layer covering the uppermost wiring layer, the insulation resin layer defining an opening through which an entire surface of the pad is exposed, the opening having an area greater than that of the surface of the pad.
Dependencies are inferred from the claim text.