Back to results
US 2011/0253306 A1Published application
Multi-layer printed circuit board and method of manufacturing multi-layer printed circuit board
AssigneeIbiden Co., Ltd.
InventorsMotoo Asai, Dongdong Wang, Takahiro Mori
Life of this patent
Estimating the term…
Abstract
A method of manufacturing a printed circuit board includes the following steps (A) to (D). (A) Laminating a resin insulating layer on each of two sides of a core member to form a core substrate, (B) forming penetrating openings in the core substrate by applying laser beams, (C) forming a rough surface on the core substrate, and (D) providing a metal film for each penetrating opening to form through holes.
Claims3
A method of manufacturing a printed circuit board comprising at least the following steps (A) to (D):
- (A) laminating a resin insulating layer on each of two sides of a core member to form a core substrate;
- (B) forming penetrating openings in said core substrate by applying laser beams;
- (C) forming a rough surface on said core substrate;
- and
- (D) providing a metal film for each penetrating opening to form through holes.
2 more elements
Dependencies are inferred from the claim text.