Package manufacturing method, package, piezoelectric vibrator, oscillator, electronic apparatus, and radio timepiece
OwnerYoichi FUNABIKIinventor
Life of this patent
Estimating the term…
Abstract
A method of manufacturing a package in which generation of voids in the interior of glass frit is restrained, so that maintenance of hermeticity in a cavity and improvement of mechanical strength of through electrodes are achieved, such a package, a piezoelectric vibrator, an oscillator, an electronic apparatus, and a radio timepiece are provided. The invention is characterized by including baking glass frit filled in through holes and solidifying the same, and the baking step is performed by a decompressed atmosphere, which is set to a pressure lower than the atmospheric pressure.
Claims22
A method for producing electronic packages, comprising:
- (a) defining a plurality of first substrates on a first wafer and a plurality of second substrates on a second wafer;
- (b) forming at least one through-hole in a respective at least some of the first substrates on the first wafer;
- (c) filling at least some of the through-holes with a filler which comprises glass frit;
- (d) baking the first wafer to harden the filler, wherein at least one of steps (c) and (d) is performed in a low pressure atmosphere;
- (e) bonding the first and second wafers such that at least some of the first substrates substantially coincide respectively with at least some of the corresponding second substrates;
- and
- (f) cutting off from the bonded first and second wafers a respective at least some of the coinciding first and second substrate pairs.
A method for producing an electronic package, comprising:
- (a) forming at least one through-hole in a substrate of the electronic package;
- (b) filling the at least one through-hole with a filler which comprises glass frit, binder and an organic solvent;
- and
- (c) baking the substrate to harden the filler, wherein at least one of steps (b) and (c) is performed in a low pressure atmosphere.
Dependencies are inferred from the claim text.