Wafer holder and method of holding a wafer
AssigneeCanon Anelva Corporation
InventorSunil WICKRAMANAYAKA
Life of this patent
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Abstract
A wafer holder including a wafer stage and a wafer stage outer-ring surrounding the wafer stage wherein the wafer stage has a diameter smaller than the diameter of a wafer loaded on the wafer stage, the wafer stage outer-ring has an inner diameter at the upper side of the outer-ring which is larger than the diameter of the wafer loaded on the wafer stage, and the upper surface of the outer-ring lies above the upper surface of the wafer loaded on the wafer stage.
Claims5
Angled sputtering Physical Vapor Deposition (PVD) apparatus provided with a wafer holder for positioning a wafer wherein a target is arranged obliquely with a predetermined angle to the wafer surface, and
- wherein the wafer holder comprises a rotatable wafer stage for mounting the wafer the diameter of which is larger than that of the wafer stage and a wafer stage outer ring which surrounds the wafer stage,
- wherein the wafer stage outer ring comprises an upper portion the inner diameter of which is larger than the diameter of the wafer mounted on the wafer stage and the top surface of which is higher than the front surface of the wafer mounted on the wafer stage, and a lower portion the inner diameter of which is smaller than the diameter of the wafer mounted on the wafer stage but larger than the diameter of the wafer stage and the top surface of which is lower than the rear surface of the wafer mounted on the wafer stage so that the top surface of the lower portion is positioned not to contact the rear surface of the wafer mounted on the wafer stage, and
- the top surface of the upper portion is high so that the upper portion makes a shadow thereof on the wafer for irradiation at the predetermined angle.
A wafer holder used in angled sputtering Physical Vapor Deposition (PVD) apparatus wherein a target is arranged obliquely with a predetermined angle to the surface of a wafer and a sputtering is performed with rotating the wafer, comprising;
- a rotatable wafer stage for mounting the wafer, and
- a wafer stage outer ring surrounding the wafer stage,
- wherein the diameter of the wafer stage is smaller than that of the wafer mounted on the wafer stage,
- wherein the wafer stage outer ring comprises an upper portion the inner diameter of which is larger than the diameter of the wafer mounted on the wafer stage and the top surface of which is higher than the front surface of the wafer mounted on the wafer stage, and a lower portion the inner diameter of which is smaller than the diameter of the wafer mounted on the wafer stage but larger than the diameter of the wafer stage and the top surface of which is lower than the rear surface of the wafer mounted on the wafer stage, so that the top surface of the lower portion is positioned not to contact the rear surface of the wafer mounted on the wafer stage.
Dependencies are inferred from the claim text.