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US 2011/0252641 A1Published application
Multi-layer printed circuit board and method of manufacturing multi-layer printed circuit board
AssigneeIbiden Co., Ltd.
InventorsMotoo ASAI, Dongdong Wang, Takahiro Mori
Life of this patent
Estimating the term…
Abstract
A method of manufacturing a multi-layer printed circuit board includes the following steps (A) and (B). (A) Providing penetrating openings which are formed into through holes and each of which has a small diameter for a core substrate, and (B) providing penetrating openings which are formed into through holes each having a large diameter for the core substrate.
Claims3
A method of manufacturing a multi-layer printed circuit board comprising at least the following steps (A) and (B);
- (A) providing penetrating openings which are formed into through holes and each of which has a small diameter for a core substrate;
- and
- (B) providing penetrating openings which are formed into through holes each having a large diameter for said core substrate.
A method of manufacturing a multi-layer printed circuit board comprising at least the following steps (A) and (B):
- (A) irradiating the central portion of a core substrate with laser beams or drilling the central portion to form penetrating openings which are formed into through holes and each of which has a small diameter;
- and
- (B) irradiating the central portion of said core substrate with laser beams or drilling the central portion to form penetrating openings which are formed into through holes and each of which has a large diameter.
Dependencies are inferred from the claim text.