Wiring board and method of manufacturing wiring board
AssigneeIbiden Co., Ltd.
InventorsMichimasa Takahashi, Masakazu Aoyama
Life of this patent
Estimating the term…
Abstract
A method of manufacturing a wiring board including forming a base substrate, forming a first insulation layer on a first surface of the base substrate and a second insulating layer on a second surface of the substrate opposing the first surface, forming an IVH (Interstitial Via Hole) that penetrates the base substrate, and cutting the first insulating layer in a first area and cutting the second insulating layer in a second area offset from said first area to form a first substrate laminated to a second substrate with the base layer interposed therebetween, the second substrate having a smaller mounting area than that of the first substrate such that the first substrate extends beyond an edge of the second substrate.
Claims15
A method of manufacturing a wiring board comprising:
- forming a base substrate;
- forming a first insulation layer on a first surface of the base substrate and a second insulating layer on a second surface of the substrate opposing the first surface;
- forming an IVH (Interstitial Via Hole) that penetrates the base substrate;
- and
- cutting the first insulating layer in a first area and cutting the second insulating layer in a second area offset from said first area to form a first substrate laminated to a second substrate with the base layer interposed therebetween, the second substrate having a smaller mounting area than that of the first substrate such that the first substrate extends beyond an edge of the second substrate.
Dependencies are inferred from the claim text.