Method of manufacturing semiconductor device
AssigneeElpida Memory, Inc.
InventorsKatsushi TAKANO, Hiroaki IZUMI, Kanji SUGINO
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Abstract
A method of manufacturing a semiconductor device may include, but is not limited to the following processes. A first group identifier allocated to a first group of semiconductor wafers is detected. The first group of semiconductor wafers includes a first semiconductor wafer to be processed first among the first group. A first processor of a plurality of processors, which process respective ones of the first group of semiconductor wafers, are determined based on the first group identifier. The first processor is used for processing the first semiconductor wafer. The first semiconductor wafer is supplied to the first processor.
Claims20
A method of manufacturing a semiconductor device, comprising:
- detecting a first group identifier allocated to a first group of semiconductor wafers, the first group of semiconductor wafers comprising a first semiconductor wafer to be processed first among the first group;
- determining, based on the first group identifier, a first processor of a plurality of processors that process respective ones of the first group of semiconductor wafers, the first processor being used for processing the first semiconductor wafer;
- and
- supplying the first semiconductor wafer to the first processor.
A method of manufacturing a semiconductor device, comprising:
- detecting a first group identifier allocated to a first group of semiconductor wafers, the first group of semiconductor wafers being housed in respective ones of a first set of slots that are numbered;
- determining, based on the first group identifier, a plurality of processors to be used for processing respective ones of the first group of semiconductor wafers;
- and
- supplying the first group of semiconductor wafers to the plurality of processors determined.
A method of manufacturing a semiconductor device, comprising:
- detecting a first group identifier allocated to a first group of semiconductor wafers having been processed by a first set of processors, the first group of semiconductor wafers being housed in a first set of slots that are numbered;
- determining, based on the first group identifier, a second set of processors to be used for processing respective ones of the first group of semiconductor wafers having been processed;
- and
- supplying the first group of semiconductor wafers to the second set of processors determined.
Dependencies are inferred from the claim text.