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US 2011/0242772 A1Published application
Pre-lamination core and method for making a pre-lamination core for electronic cards and tags
AssigneeInnovatier, Inc.
InventorROBERT SINGLETON
Life of this patent
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Abstract
The disclosed pre-lamination core and the method of making such a pre-lamination core includes an electronic component or a non-electronic component, a bottom cover sheet, a top cover sheet, and a layer of thermosetting material between the bottom and top cover sheets. The pre-lamination core can be used in the manufacture of cards while using conventional equipment to apply top and bottom overlays to the pre-lamination core.
Claims22
A pre-lamination core, comprising:
- a circuit board, having a top surface and a bottom surface;
- a plurality of circuit components attached to the top surface of the circuit board;
- a bottom cover sheet attached to the bottom surface of the circuit board, wherein the bottom cover sheet comprises a heat seal material attached to a carrier sheet;
- a top cover sheet positioned above the top surface of the circuit board, wherein the top cover sheet comprises a heat seal material attached to a carrier sheet;
- and
- a layer of thermosetting material between the bottom cover sheet and the top cover sheet.
3 more elements
A card comprising:
- an pre-lamination core comprising:
- a circuit board, having a top surface and a bottom surface;
- a plurality of circuit components attached to the top surface of the circuit board;
- a bottom cover sheet attached to the bottom surface of the circuit board, wherein the bottom cover sheet comprises a heat seal material attached to a carrier sheet;
- a top cover sheet positioned above the top surface of the circuit board, wherein the top cover sheet comprises a heat seal material attached to a carrier sheet;
- and
- a layer of thermosetting material between the bottom cover sheet and the top cover sheet;
- a top overlay heat laminated to a top surface of the pre-lamination core;
- and
- a bottom overlay heat laminated to a bottom surface of the pre-lamination core.
7 more elements
A method for manufacturing a pre-lamination core, comprising:
- providing a circuit board having a top surface and a bottom surface;
- affixing a plurality of circuit components onto the top surface of the circuit board;
- affixing the bottom surface of the circuit board to a bottom cover sheet using an adhesive, wherein the bottom cover sheet comprises a heat seal material attached to a carrier sheet;
- loading the circuit board and bottom cover sheet into an injection molding apparatus;
- loading a top cover sheet positioned above a top surface of the circuit board into the injection molding apparatus, wherein the top cover sheet comprises a heat seal material attached to a carrier sheet;
- injecting a thermosetting polymeric material between the top and bottom cover sheets to form the pre-lamination core;
- and
- removing the pre-lamination core from the injection molding apparatus;
- and
- separating the carrier sheets from the heat seal materials of the top cover sheet and bottom cover sheet.
7 more elements
A method for manufacturing a card, comprising:
- providing a circuit board having a top surface and a bottom surface;
- affixing a plurality of circuit components onto the top surface of the circuit board;
- affixing the bottom surface of the circuit board to a bottom cover sheet using an adhesive, wherein the bottom cover sheet comprises a heat seal material attached to a carrier sheet;
- loading the circuit board and bottom cover sheet into an injection molding apparatus;
- loading a top cover sheet positioned above a top surface of the circuit board into the injection molding apparatus, wherein the top cover sheet comprises a heat seal material attached to a carrier sheet;
- injecting a thermosetting polymeric material between the top and bottom cover sheets to form the pre-lamination core;
- and
- removing the pre-lamination core from the injection molding apparatus;
- separating the carrier sheets from the heat seal materials of the top cover sheet and bottom cover sheet;
- and
- providing a top overlay and a bottom overlay for heat lamination to the pre-lamination core.
8 more elements
A pre-lamination core, comprising:
- a non-electronic item;
- a bottom cover sheet attached to the bottom surface of the non-electronic item, wherein the bottom cover sheet comprises a heat seal material attached to a carrier sheet;
- a top cover sheet positioned above the top surface of the non-electronic item, wherein the top cover sheet comprises a heat seal material attached to a carrier sheet;
- and
- a layer of thermosetting material between the bottom cover sheet and the top cover sheet.
2 more elements
A card comprising:
- a pre-lamination core comprising:
- a non-electronic item;
- a bottom cover sheet, wherein the non-electronic item is attached to the top surface of the bottom cover sheet, wherein the bottom cover sheet comprises a heat seal material attached to a carrier sheet;
- a top cover sheet positioned above the non-electronic item, wherein the top cover sheet comprises a heat seal material attached to a carrier sheet;
- and
- a layer of thermosetting material between the bottom cover sheet and the top cover sheet;
- a top overlay heat laminated to a top surface of the pre-lamination core;
- and
- a bottom overlay heat laminated to a bottom surface of the pre-lamination core.
6 more elements
A method for manufacturing a pre-lamination core, comprising:
- providing a non-electronic item;
- affixing the non-electronic item to a bottom cover sheet using an adhesive, wherein the bottom cover sheet comprises a heat seal material attached to a carrier sheet;
- loading the non-electronic item and bottom cover sheet into an injection molding apparatus;
- loading a top cover sheet positioned above a top surface of the circuit board into the injection molding apparatus, wherein the top cover sheet comprises a heat seal material attached to a carrier sheet;
- injecting a thermosetting polymeric material between the top and bottom cover sheets to form the pre-lamination core;
- removing the pre-lamination core from the injection molding apparatus;
- and
- separating the carrier sheets from the heat seal materials of the top cover sheet and bottom cover sheet.
5 more elements
A method for manufacturing a card, comprising:
- providing a non-electronic item;
- affixing the non-electronic item to a bottom cover sheet using an adhesive, wherein the bottom cover sheet comprises a heat seal material attached to a carrier sheet;
- loading the non-electronic item and bottom cover sheet into an injection molding apparatus;
- loading a top cover sheet positioned above a top surface of the non-electronic item into the injection molding apparatus, wherein the top cover sheet comprises a heat seal material attached to a carrier sheet;
- injecting a thermosetting polymeric material between the top and bottom cover sheets to form the pre-lamination core;
- removing the pre-lamination core from the injection molding apparatus;
- separating the carrier sheets from the heat seal materials of the top cover sheet and bottom cover sheet;
- and
- providing a top overlay and a bottom overlay for heat lamination to the pre-lamination core.
6 more elements
Dependencies are inferred from the claim text.