Sandpaper and method of use thereof
OwnerChristian T. Zynieckiinventor
Life of this patent
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Abstract
Disclosed herein is sandpaper that includes a first plurality of particles having a first grain size, the first plurality of particles having a first sanding surface covering a first area of the sandpaper. The sandpaper includes a second plurality of particles having a second grain size that is smaller than the first grain size, the second plurality of particles having a second sanding surface covering a second area of the sandpaper. Further, the sandpaper includes a bonding layer having a back surface located opposite the first sanding surface and second sanding surface and a buffer positioned to raise the second plurality of particles such that the first sanding surface and the second sanding surface of the sandpaper are substantially planar.
Claims21
Sandpaper comprising:
- a first plurality of particles having a first grain size, the first plurality of particles having a first sanding surface covering a first area of the sandpaper;
- a second plurality of particles having a second grain size that is smaller than the first grain size, the second plurality of particles having a second sanding surface covering a second area of the sandpaper;
- a bonding layer having a back surface located opposite the first sanding surface and second sanding surface;
- and
- a buffer positioned to raise the second plurality of particles such that the first sanding surface and the second sanding surface of the sandpaper are at least one of substantially planar and planar.
Sandpaper comprising:
- a bonding layer having a bonding surface and a back surface;
- a first sandpaper portion having a first grain size attached to the bonding surface of the bonding layer over a first area of the sandpaper;
- a second sandpaper portion having a second grain size that is smaller than the first grain size, the second sandpaper portion located over a second area of the sandpaper;
- and
- a buffer located between the second sandpaper portion and the back surface, the buffer configured to raise the second plurality of particles such that a first sanding surface corresponding to the first sanding portion of the sandpaper and a second sanding surface corresponding to the second sanding portion of the sandpaper are at least one of substantially planar and planar.
A method of sanding a floor comprising:
- attaching sandpaper around a drum of a drum sander, wherein the sandpaper includes a first plurality of particles having a first grain size, and a second plurality of particles having a second grain size that is smaller than the first grain size, wherein the first plurality of particles circumferentially surrounds the drum and extends from a first side of the drum, wherein the second plurality of particles circumferentially surrounds the drum and extends from a second opposing side of the drum;
- rotating the drum of the drum sander and the attached sandpaper;
- moving the drum sander along the floor;
- and
- sanding the floor with the sandpaper.
Dependencies are inferred from the claim text.