Method and system for controlling chemical mechanical polishing by controllably moving a slurry outlet
AssigneeAdvanced Micro Devices, Inc.
InventorsAxel Kiesel, Uwe Stoeckgen, John Lampett, Heiko Wundram
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Abstract
A system and a method of operating a chemical mechanical polishing (CMP) system comprises a slurry delivering unit configured for locally varying the supply of slurry while polishing the substrate. To this end, the slurry delivering unit may comprise at least one slurry outlet over a polishing pad of the CMP system, wherein the at least one slurry outlet is controllably movable to distribute slurry over the polishing pad.
Claims21
-16. (canceled)
A method of operating a chemical mechanical polishing (CMP) system, comprising:
- polishing a substrate;
- and
- measuring a distribution of slurry over a polishing pad while polishing said substrate.
A method of operating a chemical mechanical polishing (CMP) system, comprising:
- determining at least one process parameter related to the chemical mechanical polishing of a substrate with said CMP system;
- and
- distributing slurry over a polishing pad of said CMP system in response to said at least one determined process parameter, wherein distributing said slurry comprises moving at least one slurry outlet over said polishing pad while polishing said substrate.
A method, comprising:
- measuring a distribution of slurry over a polishing pad while polishing a substrate;
- controlling a movement of at least one movable slurry outlet in response to said measured slurry distribution;
- and
- controlling a supply of slurry supplied to said at least one movable slurry outlet in response to said measured slurry distribution.
Dependencies are inferred from the claim text.