Phase change memory cell and manufacturing method thereof using minitrenches
AssigneesMicron Technology, Inc., Ovonyx, Inc.
InventorsRoberto Bez, Fabio Pellizzer, Marina Tosi, Romina Zonca
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AssigneesMicron Technology, Inc., Ovonyx, Inc.
InventorsRoberto Bez, Fabio Pellizzer, Marina Tosi, Romina Zonca
Estimating the term…
A process forms a phase change memory cell using a resistive element and a memory region of a phase change material. The resistive element has a first thin portion having a first sublithographic dimension in a first direction; and the memory region has a second thin portion having a second sublithographic dimension in a second direction transverse to the first dimension. The first thin portion and the second thin portion are in direct electrical contact and define a contact area of sublithographic extension. The second thin portion is delimited laterally by oxide spacer portions surrounded by a mold layer which defines a lithographic opening. The spacer portions are formed after forming the lithographic opening, by a spacer formation technique.
A process for manufacturing a phase change memory cell, comprising:
11-20. (canceled)
A process of forming integrated phase change memory cell, comprising:
29-32. (canceled)
Dependencies are inferred from the claim text.