Semiconductor device and method for manufacturing the same
AssigneeSemiconductor Energy Laboratory Co., Ltd.
InventorsKiyoshi KATO, Takehisa SATO
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AssigneeSemiconductor Energy Laboratory Co., Ltd.
InventorsKiyoshi KATO, Takehisa SATO
Estimating the term…
A memory element is formed by providing an organic compound between a pair of upper and lower electrodes. However, when the electrode is formed over a layer containing an organic compound, a temperature is limited because the layer containing the organic compound can be influenced depending on a temperature for forming the electrode. A forming method for the electrode is limited due to this limitation of a temperature. Therefore, there are problems that an expected electrode cannot be formed, and miniaturization of an element is inhibited. A semiconductor device includes a memory element and a switching element which are provided over a substrate having an insulating surface. The memory element includes first and second electrodes, and a layer containing an organic compound, which are provided on the same plane. A current flows from the first electrode to the second electrode. The first electrode is electrically connected to the switching element.
A method for manufacturing a semiconductor device comprising the steps of:
A method for manufacturing a semiconductor device comprising the steps of:
A method for manufacturing a semiconductor device comprising the steps of:
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Dependencies are inferred from the claim text.