Method of manufacturing semiconductor device

A method of manufacturing a semiconductor device, including placing a semiconductor chip provided with a plurality of bumps arranged in a peripheral alignment by flip-chip mounting on a substrate provided with a plurality of electrodes corresponding to the bumps via an insulating resin adhesive film,

• the method being characterized by temporarily affixing an insulating resin adhesive film of a size that is substantially 60 to 100% an area of a region enclosed with the plurality of bumps of the semiconductor chip arranged in a peripheral alignment, and having a minimum melt viscosity of 2×102 to 1×105 Pa·s, to a region enclosed with the plurality of electrodes of the substrate corresponding to the bumps;
• aligning the semiconductor chip and the substrate with each other such that the bumps and the electrodes corresponding thereto are opposed to each other;
• performing hot pressing against the semiconductor chip to establish metallic contact between the bumps and the electrodes;
• and melting the insulating resin adhesive film to further heat curing the film.