Semiconductor device
AssigneeSony Corporation
InventorsToshihide Ueno, Masao Kinoshita, Takanori Shimizu
Life of this patent
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Abstract
Improvement of signal integrity, a size reduction of a device, and the like are realized. A semiconductor integrated circuit section 11 and an optical wiring section 21 are electrically connected to each other by a connection section 31 provided between a face of the semiconductor integrated circuit section 11 and a face of the optical wiring section 21 facing each other. An electrical wiring 23 is provided in an optical wiring section 21. The electrical wiring 23 of the optical wiring section 21 functions as a global wiring electrically connecting between a plurality of circuit blocks CB provided in the semiconductor integrated circuit section 11.
Claims19
A semiconductor device comprising:
- a semiconductor integrated circuit section;
- an optical wiring section arranged to face the semiconductor integrated circuit section, and including an optical waveguide, and an optical active element and an electrical wiring arranged in the optical waveguide or adjacent to the optical waveguide;
- and
- a connection section provided between a face of the optical wiring section and a face of the semiconductor integrated circuit section facing each other, and electrically connecting the optical wiring section and the semiconductor integrated circuit section.
Dependencies are inferred from the claim text.