Analysis apparatus, analysis method and analysis program

Abstract

A first generating part assumes that a circuit board is a laminated body of a lower layer portion and an upper layer portion and sets a thermal expansion coefficient of the circuit board itself having been actually measured in advance as a thermal expansion coefficient α1 of the lower layer portion. Further, the first generating portion sets a value obtained by a Stoney's equation as a thermal expansion coefficient α2 of the upper layer portion. Then, the laminated body of the lower layer portion and the upper layer portion is segmented into a plurality of grid data and element segment data in which a position and a material of grid data are made to correspond to each other is generated. The second calculating part calculates a physical amount occurring in an analysis object based on a finite element with a variety of solvers, and outputs an analysis result. In other words, the second calculating part performs a simulation of behavior of the analysis object. This simulation is in an arbitrary temperature range set by a user.

Dependencies are inferred from the claim text.