Enhanced vbasis laser diode package

A laser diode assembly comprising:

• a silicon-on-insulator (SOI) mounting substrate configured to provide structural support to the diode assembly;
• a first layer including a first solder material disposed on the SOI mounting substrate;
• a heat spreader structure attached to the first layer;
• a second layer including a second solder material disposed on the heat spreader structure;
• and
• a laser diode bar attached to the second layer.

A method for manufacturing a laser diode assembly, the method comprising:

• providing a substrate having an upper surface and a lower surface;
• forming a plurality of v grooves in the upper surface of the substrate;
• forming an insulator layer overlying the plurality of v grooves;
• forming a metal layer over at least a portion of the plurality of v grooves;
• forming a first adhesion layer, the first adhesion layer being disposed on the metal layer;
• forming a heat spreader structure over the first adhesion layer;
• forming a second adhesion layer over the heat spreader structure;
• and
• attaching a laser diode bar to the heat spreader structure using the second adhesion layer.