US 2011/0235357 A1Published application

Vehicle headlight

AssigneeStanley Electric Co., Ltd.

InventorsNorikatsu MYOJIN, Masafumi Ohno

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Abstract

A vehicle headlight can include a semiconductor light source and a heat sink to radiate heat developed from the light source. The headlight can include a mounting base board mounting the light source and attached on a radiating base plate of the heat sink. At least one of a bottom surface of the mounting base board and the radiating base plate can include a concave portion in which a depth thereof is deeper than a maximum particle size of an inclusion of a thermal conductive viscous material that spreads in the concave portion. The light source can be located at a prescribed position in an accurate fashion without a positional misalignment while the heat developed from the light source can efficiently radiate via the heat sink. Thus, the disclosed subject matter can provide headlights including a radiation structure having a high radiating performance and positional accuracy for the light source.

Claims20

Dependent claims

A vehicle headlight comprising:

a mounting base board having a top surface and a bottom surface that are opposite with respect to each other and are formed as substantially respective flat surfaces, the top surface of the mounting base board including a mounting region;
a semiconductor light source mounted on the mounting region of the mounting base board;
a heat sink including a radiating base plate having a top surface of a substantially flat surface, the radiating base plate having a top surface, the top surface of the radiating base plate being attached to the bottom surface of the mounting base board, wherein at least one of the bottom surface of the mounting base board and the top surface of the radiating base plate includes a concave portion, the concave portion being larger than the mounting region of the mounting base board, the concave portion including an opposing surface of the mounting region of the mounting base board, the opposing surface being located on the bottom surface of the mounting base board;
a reflector having an opening portion located adjacent the radiating base board of the heat sink so that light emitted from the semiconductor light source is emitted in a light-emitting direction of the vehicle headlight from the opening portion of the reflector;
and
a thermal conductive viscous material including an inclusion having a particle size, the thermal conductive viscous material disposed in the concave portion of the at least one of the bottom surface of the mounting base board and the top surface of the radiating base plate, wherein a depth of the concave portion is deeper than a particle size of the inclusion of the thermal conductive viscous material.

3 more elements

A vehicle headlight comprising:

a mounting base board having a top surface and a bottom surface that are opposite with respect to each other and are formed in substantially respective flat surfaces, and the top surface including a mounting region;
a semiconductor light source mounted on the mounting region;
a heat sink including a radiating base plate having a top surface of a substantially flat surface, the radiating base plate having a top surface, the top surface of the radiating base plate being attached to the bottom surface of the mounting base board, wherein at least one of the bottom surface of the mounting base board and the top surface of the radiating base plate includes a concave portion, the concave portion being larger than the mounting region of the mounting base board, the concave portion including an opposing surface of the mounting region of the mounting base board, the opposing surface located on the bottom surface of the mounting base board;
a projector lens having a light outgoing surface and a rear surface located in front of the semiconductor light source so that light emitted from the semiconductor light source is emitted in a light-emitting direction of the vehicle headlight from the light outgoing surface of the projector lens;
and
a thermal conductive viscous material including an inclusion having a particle size, the thermal conductive viscous material disposed in the concave portion of the at least one of the bottom surface of the mounting base board and the top surface of the radiating base plate, wherein a depth of the concave portion is deeper than the particle size of the inclusion of the thermal conductive viscous material.

3 more elements

Dependencies are inferred from the claim text.

Facts

Application: 13/070,137Filed 23 Mar 2011
Priority: JP 2010-06633823 Mar 2010
Published: 29 Sep 2011
Term ends: Not estimatedThe source records don’t support an estimate.

Classification5 codes

F21S 41/148
The main emission direction of the LED being angled to the optical axis of the illuminating device: the main emission direction of the LED being…
F21S 45/47
Cooling of lighting devices: passive cooling, e.g. using fins, thermal conductive elements or openings
F21Y 2115/10
Light-generating elements of semiconductor light sources: light-emitting diodes [LED]
F21S
Non-portable lighting devices