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US 2011/0235298 A1Published application
Wiring substrate and method of manufacturing the wiring substrate
AssigneeRenesas Electronics Corporation
InventorShuuichi Kariyazaki
Life of this patent
Estimating the term…
Abstract
A wiring substrate includes a side-wall electroconduction layer and a land. The side-wall electroconduction layer is formed on the side-wall of a through hole formed in the substrate. The land is an electroconduction layer connected with the side-wall electroconduction layer in which only the land portion as a minimum necessary portion used for wiring is formed to the surface of the substrate. Unnecessary portion of the land other than the land portion is eliminated.
Claims12
A wiring substrate comprising:
- a side-wall electroconduction layer being an electroconduction layer formed on a side wall of a through hole opened in a substrate;
- and
- a land being an electroconduction layer connected with the side-wall electroconduction layer and formed on a surface of the substrate,
- wherein the side-wall electroconduction layer includes:
- a first side-wall electroconduction layer extending along the side-wall of the through hole, reaching the surface of the substrate, and being connected with the land, and
- a second side-wall electroconduction layer being connected with the first side-wall electroconduction layer, extending along the side-wall of the through hole and not reaching the surface of the substrate.
3 more elements
A method of manufacturing a wiring substrate comprising:
- opening a through hole in a substrate;
- forming a side-wall electroconduction layer which is an electroconduction layer on the side-wall of the through hole;
- forming a land which is an electroconduction layer connected with the side-wall electroconduction layer to the surface of the substrate;
- and
- eliminating an unnecessary portion not used for the wiring of the land and a portion of the side-wall electroconduction layer in contact with the unnecessary portion,
- wherein a first side-wall electroconduction layer that extends along the side-wall of the through hole, reaches the surface of the substrate, and is connected with the land, and
- wherein a second side-wall electroconduction layer that is connected with the first side electroconduction layer, extends along the side-wall of the through hole, and does not reach the surface of the substrate are formed on the side-wall electroconduction layer, by the elimination step.
4 more elements
Dependencies are inferred from the claim text.