Integrated circuit package component with ball conducting joints
AssigneesQuanta Computer Inc., Tech-Front (Shanghai) Computer Co. Ltd.
InventorsHong-Bin Shi, Jin-Chang Wu
Life of this patent
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Abstract
The present invention relates to an integrated circuit package component with ball conducting joints, includes a substrate and a plurality of solder joints. The solder joints are installed on one surface of the substrate. The solder joints are arranged to form a concentric array having a first zone and a second zone, the second zone encircles the first zone. The soldering area of any solder joint in the first zone of the concentric array is smaller than that of any solder joint in the second zone of the concentric array.
Claims14
An integrated circuit package component with ball conducting joints, comprising:
- a substrate having a first surface and a second surface opposite to the first surface;
- and
- a plurality of solder joints arranged on the second surface to form a concentric array for being soldered on a circuit board, the concentric array comprising a first zone and a second zone encircling the first zone,
- wherein a soldering area of each solder joint in the first zone is smaller than a soldering area of each solder joint in the second zone.
An integrated circuit package component with ball conducting joints, comprising:
- a substrate having a first surface and a second surface opposite to the first surface;
- a plurality of first solder joints respectively arranged on the second surface to define a first zone;
- and
- a plurality of second solder joints respectively arranged on the second surface to define a second zone, the second zone encircles the first zone, wherein soldering areas of the first solder joints are smaller than soldering areas of the second solder joints.
An integrated circuit package component with ball conducting joints, comprising:
- a substrate having a first surface and a second surface opposite to the second surface;
- and
- a plurality of solder joints respectively arranged on the second surface to form a concentric circle array defined by a plurality of gradually-enlarged circles in sequence encircled, soldering areas of the solder joints on the circles are the same.
Dependencies are inferred from the claim text.