Removable ic package stiffening brace and method
AssigneeAlcatel-Lucent Canada Inc.
InventorsPaul J. Brown, Alex L. Chan
Life of this patent
Estimating the term…
Abstract
Various exemplary embodiments relate to a brace for use with an integrated circuit (IC), and to an IC package with a brace, having a main body portion and a fastening portion for mechanically fastening the main body portion to the IC, by for example clipping or sliding attachment. Other exemplary embodiments relate to a method of stabilizing an IC during an operation carried out on the IC, such as a soldering operation, involving for example steps of attaching a brace to the IC, performing the operation on the IC, and/or removing the brace after performing the operation.
Claims25
A brace for use with an integrated circuit (IC), comprising:
- a main body portion;
- and
- a fastening portion for mechanically fastening the main body portion to the IC.
An IC package assembly comprising:
- an integrated circuit (IC);
- and
- a brace attachable to the IC, the brace comprising:
- a main body portion;
- and
- a fastening portion for mechanically fastening the main body portion to the IC.
A method of stabilizing an IC during an operation carried out on the IC, comprising:
- attaching a brace to the IC;
- and
- performing the operation on the IC.
A method of stabilizing an IC during an operation carried out on the IC, comprising:
- performing an operation on the IC while the IC has a brace removably attached to the IC;
- and
- removing the brace from the IC after performing the operation.
Dependencies are inferred from the claim text.