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AssigneeRF Micro Devices, Inc.
InventorsDonald Joseph Leahy, Waite R. Warren, JR., Stephen Parker
Estimating the term…
In one embodiment, a meta-module having circuitry for two or more modules is formed on a substrate, which is preferably a laminated substrate. The circuitry for the different modules is initially formed on the single meta-module. Each module will have one or more component areas in which the circuitry is formed. A metallic structure is formed on or in the substrate for each component area to be shielded. A single body, such as an overmold body, is then formed over all of the modules on the meta-module. At least a portion of the metallic structure for each component area to be shielded is then exposed through the body by a cutting, drilling, or like operation. Next, an electromagnetic shield material is applied to the exterior surface of the body of each of the component areas to be shielded and in contact with the exposed portion of the metallic structures.
A method of manufacturing a module comprising:
A module manufactured by a process comprising:
The module manufactured by the process of claim 31 wherein plating the at least one conductive material over the at least portions of the exterior surfaces of the body and on the plurality of exposed metallic structures comprises plating a first layer with an electroless plating process and plating a second layer with an electrolytic plating process.
Dependencies are inferred from the claim text.