Circuit module
AssigneeMurata Manufacturing Co., Ltd.
InventorKoichi HARA
Life of this patent
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AssigneeMurata Manufacturing Co., Ltd.
InventorKoichi HARA
Estimating the term…
A circuit module includes a plurality of electronic components including at least one heat-generating electronic component and constituting an electric circuit are spaced from each other on a circuit board. Regions of one or both sides of the circuit board, including regions around the plurality of electronic components, are covered with a heat-dissipating member. A surface of the heat-dissipating member facing the circuit board includes irregularities. An end surface of a protrusion in the facing surface of the heat-dissipating member is in contact with a circuit board surface between the electronic components, directly or with a heat-dissipating sheet interposed therebetween. A wall surface of a recess in the facing surface of the heat-dissipating member is in surface-contact with the heat-generating electronic component within the recess, directly or with the heat-dissipating sheet interposed therebetween. Thus, heat from the heat-generating electronic component and heat from the circuit board heated by the heat from the heat-generating electronic component are dissipated outside through the heat-dissipating member.
A circuit module comprising:
Dependencies are inferred from the claim text.