Suspension substrate, manufacturing method of suspension substrate, suspension, device-mounted suspension, and hard disk drive

A suspension substrate, comprising a metal supporting substrate, an insulating layer formed on the metal supporting substrate, and a wiring layer formed on the insulating layer;

• wherein in a connecting terminal area for connecting with a device, the wiring layer has a wiring layer projecting section projecting from an end portion of the metal supporting substrate and composing a connecting terminal;
• in the connecting terminal area, the insulating layer has an insulating layer projecting section projecting from the end portion of the metal supporting substrate and supporting the wiring layer projecting section;
• the wiring layer projecting section is provided by a plurality;
• an adjusting section formed on the insulating layer and composed of a first adjusting section and a second adjusting section is provided on both sides of the plural wiring layer projecting sections;
• and
• in a case when outermost wiring layer projecting sections of the plural wiring layer projecting sections are regarded as a first outermost wiring layer projecting section and a second outermost wiring layer projecting section respectively, a gap between the first outermost wiring layer projecting section and the first adjusting section, a gap between the adjacent wiring layer projecting sections, and a gap between the second outermost wiring layer projecting section and the second adjusting section are equal.

A manufacturing method of a suspension substrate, comprising the steps of:

• preparing a laminated body and etching an insulating member,
• wherein in the laminated body preparing step, the laminated body comprises a metal supporting substrate, an insulating member formed on the metal supporting substrate, and a wiring layer formed on the insulating member;
• in a position for forming a connecting terminal area for connecting with a device, the wiring layer has a wiring layer projecting section projecting from an end portion of the metal supporting substrate and composing a connecting terminal;
• the wiring layer projecting section is provided by a plurality;
• an adjusting section formed on the insulating member and composed of a first adjusting section and a second adjusting section is provided on both sides of the plural wiring layer projecting sections;
• and
• in a case when outermost wiring layer projecting sections of the plural wiring layer projecting sections are regarded as a first outermost wiring layer projecting section and a second outermost wiring layer projecting section respectively, a gap between the first outermost wiring layer projecting section and the first adjusting section, a gap between the adjacent wiring layer projecting sections, and a gap between the second outermost wiring layer projecting section and the second adjusting section are equal;
• and
• wherein in the insulating member etching step, the insulating member is wet-etched while using the wiring layer projecting section and the adjusting section as a resist to form an insulating layer having an insulating layer projecting section projecting from the end portion of the metal supporting substrate and supporting the wiring layer projecting section.