Mechanical layer and methods of shaping the same
AssigneeQUALCOMM MEMS Technologies, Inc.
InventorsYi Tao, Fan Zhong, Teruo Sasagawa
Life of this patent
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Abstract
A method of shaping a mechanical layer is disclosed. In one embodiment, the method comprises depositing a support layer, a sacrificial layer and a mechanical layer over a substrate, and forming a support post from the support layer. A kink is formed adjacent to the support post in the mechanical layer. The kink comprises a rising edge and a falling edge, and the kink can be configured to control the shaping and curvature of the mechanical layer upon removal of the sacrificial layer.
Claims33
An electromechanical systems device, comprising:
- a substrate;
- a mechanical layer having an actuated position and a relaxed position;
- and
- a support structure on the substrate for supporting the mechanical layer, wherein the support structure is configured to space the mechanical layer from the substrate to define a collapsible gap, wherein the gap is in a collapsed condition when the mechanical layer is in the actuated position and in a non-collapsed condition when the mechanical layer is in the relaxed position,
- wherein the mechanical layer comprises a kink adjacent to the support structure, wherein the kink comprises a rising portion and a falling portion, wherein the rising portion extends away from the gap and the falling portion extends toward the gap.
An electromechanical systems device, comprising:
- a substrate means;
- a deformable means having a relaxed and an actuated position;
- and
- a support means for supporting the deformable means and for spacing the deformable means from the substrate by a collapsible gap, wherein the collapsible gap is in a collapsed condition when the deformable means is in the actuated position and in a non-collapsed condition when the deformable means is in the relaxed position,
- wherein the deformable means comprises a shaping means for directing curvature of the deformable means.
A method of shaping a mechanical layer in an electromechanical systems device, comprising:
- providing a substrate;
- depositing a support layer over at least a portion of the substrate;
- forming a support post from at least the support layer;
- providing a mechanical layer with a kink adjacent to the support post, wherein the kink comprises a rising edge and a falling edge;
- and
- supporting the mechanical layer with the support post to define a collapsible gap over the substrate.
Dependencies are inferred from the claim text.