Heat dissipating structure for an imaging unit
AssigneePanasonic Corporation
InventorsKoji YASUDA, Masanao Wakikawa
Life of this patent
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Abstract
A heat dissipating structure for an imaging unit includes an imaging element configured to convert light into an electrical signal, a first heat dissipating plate, a second heat dissipating plate, and a heat dissipating portion. The first heat dissipating plate has a first end and a second end disposed opposite to the first end, and is positioned on the rear face side of the imaging element. The second heat dissipating plate is positioned on the rear face side of the first heat dissipating plate. The heat dissipating portion is fixedly coupled to the first end of the second heat dissipating plate.
Claims19
A heat dissipating structure for an imaging unit, comprising:
- an imaging element configured to convert light into an electrical signal;
- a first heat dissipating plate positioned on the rear face side of the imaging element;
- a second heat dissipating plate having a first end and a second end disposed opposite to the first end, the second heat dissipating plate being positioned on the rear face side of the first heat dissipating plate;
- and
- a heat dissipating portion fixedly coupled to the first end of the second heat dissipating plate.
A heat dissipating structure for an imaging unit, comprising:
- an imaging element configured to convert light into an electrical signal;
- a first heat dissipating plate positioned on the rear face side of the imaging element;
- a second heat dissipating plate positioned on the rear face side of the first heat dissipating plate;
- and
- a battery case connected to the second heat dissipating plate and configured to hold a battery.
Dependencies are inferred from the claim text.