Integrated Circuit Package Assembly Including Wave Guide
AssigneeInfineon Technologies AG
InventorsLinus Maurer, Alexander Reisenzahn, Markus Treml, Thomas Wickgruber
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Abstract
Some embodiments herein relate to a transmitter. The transmitter includes an integrated circuit (IC) package including a first antenna configured to radiate a first electromagnetic signal therefrom. A printed circuit board (PCB) substrate includes a waveguide configured to receive the first electromagnetic signal and to generate a waveguide signal based thereon. A second antenna can be electrically coupled to the waveguide and can radiate a second electromagnetic signal that corresponds to the waveguide signal. Other devices and methods are also disclosed.
Claims19
A transmitter, comprising:
- a integrated circuit (IC) package including a first antenna configured to radiate a first electromagnetic signal therefrom, wherein the IC package has a first engagement surface;
- and
- a printed circuit board (PCB) substrate having a second engagement surface physically coupled to the first engagement surface, wherein the PCB substrate includes a waveguide configured to receive the first electromagnetic signal and to generate a waveguide signal based thereon;
- and
- a second antenna electrically coupled to the waveguide and configured to radiate a second electromagnetic signal that corresponds to the first electromagnetic signal by using the waveguide signal.
An integrated circuit (IC) package assembly, comprising:
- a printed circuit board (PCB) substrate having an aperture extending therethrough along an aperture axis, wherein the aperture is defined by inwardly-facing sidewalls of the PCB substrate;
- an antenna positioned proximate to the aperture axis and configured to generate an electromagnetic wave;
- a first conductive layer disposed on the inwardly-facing sidewalls to laterally surround the aperture axis and arranged to induce a time-varying signal thereon, wherein the time-varying signal is indicative of the power of the electromagnetic wave over time.
An integrated circuit (IC) package assembly, comprising:
- a printed circuit board (PCB) substrate having a first engagement surface with an aperture therein, wherein the aperture extends from the first engagement surface through the PCB substrate and out an opposing surface of the PCB substrate along an aperture axis, thereby defining inwardly-facing sidewalls in the PCB substrate;
- a IC package having a second engagement surface physically coupled to the first engagement surface, wherein the IC package includes an antenna positioned proximate to the aperture axis and configured to generate an electromagnetic wave;
- and
- a waveguide formed on the inwardly-facing sidewalls to laterally surround the aperture, wherein the waveguide is configured to detect the electromagnetic wave and generate a signal corresponding thereto.
An integrated circuit (IC) package assembly, comprising:
- a printed circuit board (PCB) substrate having an aperture extending therethrough along an aperture axis;
- a solder-ball arrangement disposed over the PCB substrate, wherein a perimeter of the solder-ball arrangement at least partially surrounds the aperture axis;
- an antenna disposed laterally within or over the solder-ball arrangement and disposed proximate to the aperture axis, wherein the antenna is configured to transmit an electromagnetic wave;
- a first conductive layer substantially covering inwardly-facing sidewalls defined by the aperture, wherein the first conductive layer is arranged to generate a waveguide signal indicative of changes in the electromagnetic wave.
19-21. (canceled)
Dependencies are inferred from the claim text.