Room temperature direct metal-metal bonding
OwnerJun Wei, Xiao Fang Ang +2inventors
InventorsJun Wei, Xiao Fang Ang, Chee Cheong Wong, Zhong Chen
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OwnerJun Wei, Xiao Fang Ang +2inventors
InventorsJun Wei, Xiao Fang Ang, Chee Cheong Wong, Zhong Chen
Estimating the term…
A method for forming direct metal-metal bond between metallic surfaces is disclosed. The method comprises depositing a first nanostructured organic coating (118) on a first metallic surface (116) to form a first passivation layer thereon, the first nanostructured organic coating (118) comprising an organic phase with nanoparticles dispersed within the organic phase, contacting the first nanostructured organic coating (118) with a second metallic surface (126), and applying on the first and second metallic surfaces (116, 126) at least a bonding temperature of at least room temperature and/or a bonding pressure for a bonding period to bond the first and second metallic surfaces (116, 126) thereby forming the direct metal-metal bond therebetween. A second nanostructured organic coating (128) comprising an organic phase with nanoparticles dispersed within the organic phase may also be deposited on the second metallic surface (126).
1-42. (canceled)
A method for forming direct metal-metal bond between metallic surfaces, the method comprising:
A method for forming direct metal-metal bond between metallic surfaces, the method comprising:
A nanostructured organic coating for forming a direct metal-metal bond between metallic surfaces, the nanostructured organic coating comprises an organic phase with nanoparticles dispersed within the organic phase.
An article capable of forming a direct metal-metal bond, comprising a metallic surface and a nanostructured organic coating adjacent to the metallic surface wherein the nanostructured organic coating comprises an organic phase with nanoparticles dispersed within the organic phase.
Dependencies are inferred from the claim text.