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US 2011/0226840 A1Published application
Nano-soldering to single atomic layer
AssigneeThe Regents of the University of California
InventorsCaglar O. Girit, Alexander K. Zettl
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Abstract
A simple technique to solder submicron sized, ohmic contacts to nanostructures has been disclosed. The technique has several advantages over standard electron beam lithography methods, which are complex, costly, and can contaminate samples. To demonstrate the soldering technique graphene, a single atomic layer of carbon, has been contacted, and low- and high-field electronic transport properties have been measured.
Claims16
A method of making contact to nanostructures, comprising the steps of:
- providing a melted solder bead;
- inserting a metal tip into the solder bead;
- pulling the metal tip out from the solder bead to form a submicron solder spike on the tip;
- providing a nanostructure on a heated holder;
- contacting the nanostructure with the solder spike to form a contact;
- and
- allowing the heated holder to cool so that the contact can solidify.
4 more elements
A solder technique for wirebonding, comprising the steps of:
- providing a melted solder bead;
- inserting a metal tip into the solder bead;
- pulling the metal tip out from the solder bead to form a submicron solder spike on the tip;
- providing a device with a lead on a heated holder;
- positioning a fine wire near the lead;
- contacting the lead and the fine wire with the solder spike to form a contact;
- and
- allowing the heated holder to cool so that the contact can solidify.
5 more elements
Dependencies are inferred from the claim text.