Bonding method, bonding apparatus, and manufacturing method of semiconductor device unsing the same

A bonding apparatus for performing bonding operation to a pad disposed on a free end of an overhanging die, the apparatus comprising:

• a capillary having a wire inserted therethrough;
• an ultrasonic vibrator configured to apply ultrasonic wave to a bonding target through the capillary;
• an ultrasonic horn holding the capillary at one end and having the ultrasonic vibrator at the other end, and configured to transmit the ultrasonic wave to the capillary;
• a load detector configured to detect a load acting on the capillary;
• bonding control means for moving the capillary to a predetermined bonding position to bond the wire to the pad, and forming a wire loop by moving the capillary along a predetermined trajectory;
• and
• load change detecting means for, when moving the capillary, detecting a position of the capillary and the load acting on the capillary that has been detected by the load detector in association with each other, wherein
• the bonding control means forms the wire loop by obtaining a load change point based on the position of the capillary and the load acting on the capillary that have been detected by the load change detecting means, calculating a movement distance of the capillary by calculating a difference between a position of the capillary at the load change point and the bonding position, retracting the capillary by the movement distance, and moving the capillary along the predetermined trajectory, the load change point being a point at which the load acting on the capillary changes.

A manufacturing method of a semiconductor device by performing bonding operation to a pad disposed on a free end of an overhanging die, the method comprising:

• a step of providing a semiconductor device that comprises:
• a capillary having a wire inserted therethrough;
• an ultrasonic vibrator configured to apply ultrasonic wave to a bonding target through the capillary;
• an ultrasonic horn holding the capillary at one end and having the ultrasonic vibrator at the other end, and configured to transmit the ultrasonic wave to the capillary;
• a bonding arm having an arm base-end portion swingably attached, an arm tip-end portion disposed on a tip-end side of the arm base-end portion and configured to hold the ultrasonic horn, and a connecting portion having flexibility and configured to connect the arm base-end portion and the arm tip-end portion;
• and
• a load detector provided between a rotational center of the bonding arm and the arm tip-end portion so as to offset from a central axis of the ultrasonic horn along a longitudinal direction in a direction approaching toward and retracting from the bonding target, and configured to detect a load acting on the capillary;
• a first moving step of moving the capillary to a predetermined bonding position;
• a load change detecting step of, when moving the capillary, detecting a position of the capillary and the load acting on the capillary that has been detected by the load detector in association with each other;
• a bonding step of bonding the wire to the pad at the bonding position;
• a movement distance calculating step of calculating a movement distance of the capillary by obtaining a load change point based on the position of the capillary and the load acting on the capillary that have been detected in the load change detecting step, and by calculating a difference between a position of the capillary at the load change point and the bonding position, the load change point being a point at which the load acting on the capillary changes;
• a second moving step of retracting the capillary after bonding the wire to the pad, by the movement distance;
• and
• a loop forming step of forming a wire loop by moving the capillary along a predetermined trajectory after the second moving step.