Bonded Circuits and Seals in a Printing Device
AssigneeFUJIFILM Corporation
InventorsKevin Von Essen, John A. Higginson, Andreas Bibl
Life of this patent
Estimating the term…
Abstract
A fluid ejection device includes a circuit layer having a fluid outlet on a lower surface, a chamber substrate having a fluid inlet on an upper surface, an electrical contact electrically connecting the chamber substrate to the lower surface of the circuit layer, and a seal forming a fluid connection between the fluid outlet of the circuit layer and the fluid inlet of the chamber substrate. The seal and the electrical contact are a eutectic material. The seal and the electrical contact may be the same material.
Claims30
A fluid ejection device, comprising:
- a circuit layer having a fluid outlet on a lower surface;
- a chamber substrate having a fluid inlet on an upper surface;
- an electrical contact electrically connecting the chamber substrate to the lower surface of the circuit layer;
- and
- a seal forming a fluid connection between the fluid outlet of the circuit layer and the fluid inlet of the chamber substrate, wherein the seal and the electrical contact are a eutectic material.
A method of forming a fluid ejection device, comprising:
- forming a contact bump and a seal bump of a first material on a lower surface of a circuit layer, wherein the circuit layer has a fluid outlet on the lower surface;
- forming a contact bump of a second material and a seal bump of the second material on an upper surface of a chamber substrate, wherein the chamber substrate has a fluid inlet formed in the upper surface;
- bringing together the contact bump of the first material on the lower surface of the circuit layer and the contact bump of the second material on the upper surface of the chamber substrate;
- bringing together the seal bump of the first material on the lower surface of the circuit layer and the seal bump of the second material on the upper surface of the chamber substrate;
- heating the contact bump on the chamber substrate to form a eutectic bond between the contact bump on the lower surface of the circuit layer and the contact bump of the upper surface of the chamber substrate to form an electrical contact;
- and
- heating the seal bump on the chamber substrate to form a eutectic bond between the seal bump on the lower surface of the circuit layer and the seal bump of the upper surface of the chamber substrate to form a seal.
A fluid ejection device, comprising:
- a fluid feed substrate having a fluid outlet on a lower surface;
- a chamber substrate having a fluid inlet on an upper surface;
- a seal forming a fluid connection between the fluid outlet of the fluid feed substrate and the fluid inlet of the chamber substrate, wherein the seal is a eutectic material formed of a first material and a second material;
- a stand-off bump between the fluid feed substrate and the chamber substrate, wherein the stand-off bump includes the first material, but does not include the second material.
Dependencies are inferred from the claim text.