Method for manufacturing photoelectric-conversion-device, device for photoelectric-conversion-device manufacturing device, and photoelectric conversion device

A device for manufacturing a photoelectric-conversion-device comprising:

• a laser oscillator that irradiates a thin film constituting a photoelectric conversion device with a laser;
• and
• transporting means that moves the laser relative to the thin film to form a processed groove in a predetermined scanning direction,
• wherein interference-fringe forming means is further provided that forms interference fringes arranged in parallel in one direction in an irradiated area corresponding to a beam diameter of the laser;
• and
• the transporting means relatively moves the laser such that the interference fringes are joined in the scanning direction.

A photoelectric conversion device comprising:

• a substrate;
• a substrate-side electrode that is formed on the substrate;
• a substrate-side-electrode separating groove that separates the substrate-side electrode;
• a first photoelectric conversion layer that is formed on the substrate-side electrode and in the substrate-side-electrode separating groove and that is formed mainly of silicon;
• an intermediate contact layer that is formed on the first photoelectric conversion layer and that is electrically and optically connected to the first photoelectric conversion layer;
• an intermediate-contact-layer separating groove that separates the intermediate contact layer and that is formed so as to be adjacent to the substrate-side-electrode separating groove;
• a second photoelectric conversion layer that is formed on the intermediate contact layer and in the intermediate-contact-layer separating groove, that is electrically and optically connected to the intermediate contact layer, and that is formed mainly of silicon;
• and
• a connecting groove that separates the second photoelectric conversion layer, the intermediate contact layer, and the first photoelectric conversion layer, that is formed so as to be adjacent to the intermediate-contact-layer separating groove, and that electrically connects a back-side electrode and the substrate-side electrode,
• the substrate-side-electrode separating groove, the intermediate-contact-layer separating groove, and the connecting groove being formed in parallel in this order,
• wherein the intermediate-contact-layer separating groove corresponds to a processed groove;
• the intermediate-contact-layer separating groove is adjacent to and is partially overlapped with the substrate-side-electrode separating groove;
• and/or
• the intermediate-contact-layer separating groove is adjacent to and is partially overlapped with the connecting groove.