Patterning process
Assignee3M Innovative Properties Company
InventorsLijun Zu, Matthew H. Frey, Suresh S. Iyer
Life of this patent
Estimating the term…
Abstract
A patterning process comprises (a) providing at least one substrate having at least one major surface; (b) providing at least one patterning composition comprising at least one functionalizing molecule that is a perfluoropolyether organosulfur compound; (c) applying the patterning composition to the major surface of the substrate in a manner so as to form at least one functionalized region and at least one unfunctionalized region of the major surface; and (d) etching at least a portion of the unfunctionalized region.
Claims25
A process comprising (a) providing at least one substrate having at least one major surface;
- (b) providing at least one patterning composition comprising at least one functionalizing molecule that is a perfluoropolyether organosulfur compound;
- (c) applying said patterning composition to said major surface of said substrate in a manner so as to form at least one functionalized region and at least one unfunctionalized region of said major surface;
- and (d) etching at least a portion of said unfunctionalized region.
(canceled)
(canceled)
(canceled)
(canceled)
A process comprising (a) providing at least one substrate having at least one major surface, said substrate comprising gold;
- (b) providing at least one patterning composition comprising at least one functionalizing molecule that is an amide-linked perfluoropolyether organosulfur compound;
- (c) applying said patterning composition to said major surface of said substrate by microcontact printing so as to form at least one functionalized region and at least one unfunctionalized region of said major surface;
- and (d) selectively etching at least a portion of said unfunctionalized region by using a tri-iodide chemical etchant system.
(canceled)
Dependencies are inferred from the claim text.