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US 2011/0226730 A1Published application
Die stacking with an annular via having a recessed socket
AssigneeMicron Technology, Inc.
InventorDave Pratt
Life of this patent
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Abstract
A die stack including a die having an annular via with a recessed conductive socket and methods of forming the die stack provide a structure for use in a variety of electronic systems. In an embodiment, a die stack includes a conductive pillar on the top of a die inserted into the recessed conductive socket of another die.
Claims6
A method comprising:
- etching a first surface of the substrate to form an annular opening;
- forming a first passivation layer over sidewalls of the annular opening;
- filling the annular opening with a first conductive material, such that a metal via is formed, the metal via including a planar end portion covering a portion of the first surface of the substrate and extending on the first surface outward from outer edges of the annular opening;
- removing a substrate material from a second surface of the substrate including an area surrounded by the metal via, such that a portion of the metal via extends out from the second surface of the substrate;
- removing at least a portion of the first passivation layer from inner walls and an inner portion of exposed ends of the metal via at the second surface of the substrate;
- forming a second passivation layer over a portion of the second surface of the substrate surrounding the inner portion of the exposed ends of the metal via, such that a recessed area surrounded by inner walls of the metal via is formed;
- and
- coating a layer of a second conductive material on the recessed area to form a conductive socket.
5 more elements
The method of claim 12, wherein etching the first surface of the substrate is performed over an area of the first surface of the substrate coated with a conductive pad, wherein the annular opening is concentric with the conductive pad.
Dependencies are inferred from the claim text.