Textile-type electronic component package, method for manufacturing the same, and method for mounting the same on textile

A method for manufacturing a textile-type electronic component package, the method comprising:

• coating a thermoplastic adhesive on the bottom surface of a textile base;
• forming a textile-type electronic component and a plurality of conductive patterns having end contact points on the top surface of the textile base;
• forming a plurality of mounting pads on the thermoplastic adhesive facing the end contact points of the conductive patterns;
• sequentially drilling portions of the end contact points, the textile base, and the thermoplastic adhesive to form a plurality of via-holes partially exposing the top surfaces of the mounting pads;
• and
• filling the plurality of via-holes with a conductive polymer to form a plurality of via-hole-type coupling parts to electrically couple the mounting pads and the conductive patterns.

A method for mounting a textile-type electronic component package, the method comprising:

• preparing a textile-type electronic component package in which a textile-type electronic component and a plurality of conductive patterns having end contact points are formed on the top surface of a textile base, a thermoplastic adhesive and a plurality of mounting pads made of a conductive polymer are formed on the bottom surface of the textile base, and a plurality of via-hole-type coupling parts are formed to electrically couple the mounting pads which face the end contact points of the conductive patterns;
• aligning the textile-type electronic component package at a target position of a textile having conductive circuit patterns;
• and
• applying heat to a region where the textile-type electronic component package and the conductive circuit patterns are contacted together to sinter the conductive polymer and attach the textile-type electronic component package to the textile.

A textile-type electronic component package comprising:

• a textile base;
• a textile-type electronic component and a plurality of conductive patterns having end contact points formed on the top surface of the textile base;
• a thermoplastic adhesive formed on the bottom surface of the textile base;
• and
• a plurality of via-hole-type coupling parts penetrating the end contact points of the conductive patterns, the textile base, and the thermoplastic adhesive to electrically couple to the conductive patterns.

A method for manufacturing and mounting a textile-type electronic component package, the method comprising:

• coating a thermoplastic adhesive on the bottom surface of a textile base;
• forming a textile-type electronic component and a plurality of conductive patterns having end contact points on the top surface of the textile base;
• sequentially drilling portions of the end contact points, the textile base, and the thermoplastic adhesive to form a plurality of via-holes;
• aligning the textile base, in which the plurality of via-holes are formed, at a target position of a textile having conductive circuit pattern;
• filling the plurality of via-holes with a conductive polymer;
• and
• applying heat to a region where the textile base and the conductive circuit patterns are contacted together to sinter the conductive polymer and attach the textile base to the textile.