Electronic component package and method for producing electronic component package

A method for producing an electronic component package, comprising;

• preparing a circuit board having a base member, an electrically-conductive conductor post which is buried in said base member, and a solder layer which is provided at the front end of said conductor post while exposed from a surface of said base member,
• preparing an electronic component in which an electrode pad having a metal layer mounted thereon is provided on the main surface thereof,
• forming an adhesive layer by attaching an adhesive layer containing a flux activating compound to at least one of said surface of said circuit board and said main surface of said electronic component, and covering said solder layer or said metal layer,
• aligning the position by bringing said circuit board and said electronic component into pressure contact with each other in a heated state while said conductor post and said electrode pad are opposed to each other, thus bonding said circuit board and said electronic component with said adhesive layer, and aligning the positions of said solder layer and said metal layer, and
• metal-bonding said solder layer and said metal layer by heat-melting said solder layer.