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US 2011/0226460 A1Published application
Thermal design power integration
OwnerSigmund Sommerinventor
Life of this patent
Estimating the term…
Abstract
A heat dissipation device having the ability to communicate heat dissipation information and/or capabilities such as a Thermal Design Power rating.
Claims18
A heat dissipating device including:
- a memory;
- the memory being dedicated to storing information related to the operation of the heat dissipating device, the memory having first data thereon indicative of the thermal properties of the heat dissipating device;
- and
- a communication port;
- the communication port coupled to the memory to permit communication of the first data to a processing unit.
2 more elements
A heatsink including:
- a heat dissipating body;
- and
- a memory coupled to the heat dissipating body and dedicated to storing information related to operation of the heatsink.
A heat dissipating device including:
- a heat dissipating body;
- a fan coupled to the heat dissipating body;
- and
- a printed circuit board, including:
- a memory dedicated to storing heat dissipating information;
- a processor dedicated to performing operations related to heat dissipation;
- a fan controller;
- and
- an output port configured to output heat dissipation information to a motherboard.
6 more elements
A device interconnect including:
- first, second, third, and fourth electrically conductive wires;
- a first terminal coupled to each of the first, second, third, and fourth wires;
- a second terminal coupled to each of the first, second, third, and fourth wires;
- each of the first and second terminals including four similarly sized voids therein and a fifth void that is differently sized than the four similarly sized voids, three of the similarly sized voids being located in a row with similar spacing between the first and second voids and the second and third voids, the fourth void being located in a row with the fifth void and in a column with the third void;
- the fifth void being disposed at least partially within each of the columns of the first and second voids.
2 more elements
Dependencies are inferred from the claim text.