Process Chamber, Semiconductor Manufacturing Apparatus and Substrate Processing Method Having the Same

A semiconductor manufacturing apparatus comprising:

• a transfer chamber provided with a substrate moving device to move substrates;
• a load lock chamber to align the substrates and to load and unload the substrates into and out of the transfer chamber;
• and
• at least one process chamber to process the substrates transferred from the transfer chambers,
• wherein each of the at least one process chamber includes:
• a chamber body provided with a substrate entrance formed on a side surface thereof;
• a substrate support provided within the chamber body such that at least two substrates are disposed on the substrate support;
• and
• at least one divider provided within the chamber body to align the at least two substrates.

A substrate processing method comprising:

• sequentially loading at least two substrates into a first chamber provided with alignment members;
• aligning corners of the at least two substrates using the alignment members;
• conveying the at least two substrates from the first chamber to a second chamber using a substrate conveyor unit;
• and
• conveying the at least two substrates from the second chamber to a third chamber using the substrate conveyor unit,
• wherein the at least two substrates are loaded in the third chamber in the same pattern as an aligned pattern of the at least two substrates within the first chamber.