Method of manufacturing a multilayer printed circuit board with a built-in electronic device
AssigneeUnitech Printed Circuit Board Corp.
InventorsCheng-Hsien CHOU, Shun-Yueh HSU, Kun-Chi CHEN, Hung-Min CHEN
Life of this patent
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Abstract
A method of manufacturing a multilayer printed circuit board of a built-in electronic device provides a substrate having a copper clad laminate and a first dielectric layer. The first dielectric layer is laminated onto the copper clad laminate and has a cavity for accommodating the electronic device. A second dielectric layer is laminated onto the substrate and electronic device to produce a base circuit board with an embedded electronic device. A build-up circuit layer is formed on the base circuit board. The first and second dielectric layers are made of a plastic material.
Claims48
A method of manufacturing a multilayer printed circuit board of a built-in electronic device, comprising the steps of:
- providing a substrate, comprising a copper clad laminate with a copper foil layer;
- and
- laminating a first dielectric layer onto the copper clad laminate, and the first dielectric layer having a plastic property and including a cavity formed thereon;
- installing the electronic device into the cavity penetrated through the first dielectric layer;
- laminating a second dielectric layer with a plastic property onto the substrate and the electronic device, and the second dielectric layer having to produce a base circuit board;
- and
- forming a build-up circuit layer onto the base circuit board.
A method of manufacturing a multilayer printed circuit board of a built-in electronic device, comprising the steps of:
- providing a substrate including a copper clad laminate, and the copper clad laminate including a copper foil layer and an electric circuit on the copper foil layer;
- and
- laminating a first dielectric layer with a plastic property on the copper clad laminate, and the first dielectric layer, and the first dielectric layer having a cavity penetrated through the first dielectric layer;
- installing the electronic device into the cavity penetrated through the first dielectric layer;
- laminating a second dielectric layer with a plastic property onto the substrate and the electronic device to produce a base circuit board;
- and
- forming a build-up circuit layer on the base circuit board.
A method of manufacturing a multilayer printed circuit board of a built-in electronic device, comprising the steps of;
- providing a substrate, and the substrate including a copper clad laminate with a metal board and a copper foil layer coated onto the metal board;
- laminating a first dielectric layer with a plastic property onto the copper clad laminate, and the first dielectric layer having a cavity penetrated through the first dielectric layer;
- installing the electronic device into the cavity penetrated through the first dielectric layer;
- laminating a second dielectric layer with a plastic property onto the substrate and the electronic device to produce a base circuit board;
- and
- forming an electric circuit on the base circuit board.
A method of manufacturing a multilayer printed circuit board of a built-in electronic device, comprising the steps of:
- providing a substrate, and the substrate including a copper clad laminate with a copper foil layer and an electric circuit formed on the copper foil layer, and a protective plastic layer coated on the electric circuit;
- and
- a first dielectric layer, with a plastic property being laminated on the copper clad laminate, and having a cavity penetrated through the first dielectric layer;
- and
- installing an electronic device on the protective plastic layer, sheathing the first dielectric layer through the cavity, and coating an adhesive agent between the electronic device and the protective plastic layer;
- laminating a second dielectric layer with a plastic property onto the substrate and the electronic device, and the second dielectric layer to produce a base circuit board;
- and
- forming the base circuit board on the build-up circuit layer.
Dependencies are inferred from the claim text.