Test apparatus and manufacturing method
AssigneeAdvantest Corporation
InventorsDaisuke WATANABE, Toshiyuki OKAYASU
Life of this patent
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AssigneeAdvantest Corporation
InventorsDaisuke WATANABE, Toshiyuki OKAYASU
Estimating the term…
Provided is a test apparatus that tests a plurality of devices under test formed on a wafer under test. The test apparatus comprises a test substrate that faces the wafer under test and is electrically connected to the devices under test; a programmable device that is provided on the test substrate and changes a logic relationship of output logic data with respect to input logic data, according to program data supplied thereto; a plurality of input/output circuits that are provided on the test substrate to correspond to the devices under test and that each supply the corresponding device under test with a test signal corresponding to the output logic data of the programmable device; and a judging section that judges pass/fail of each device under test, based on operation results of each device under test according to the test signal.
A test apparatus that tests a plurality of devices under test formed on a wafer under test, the test apparatus comprising:
A method of manufacturing a test substrate that is electrically connected to a plurality of devices under test formed on a wafer under test and that tests the devices under test, the method comprising:
Dependencies are inferred from the claim text.