Pre-aligner apparatus
AssigneeKawasaki Jukogyo Kabushiki Kaisha
InventorYasuhiko Hashimoto
Life of this patent
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Abstract
The apparatus includes a rotary mechanism for holding a semiconductor wafer and rotating the same, a detection mechanism for detecting a positioning cutout portion formed in the wafer, and a wafer transfer mechanism for lifting the wafer from a wafer mounting portion of the rotary mechanism or mounting the wafer on the same. The wafer transfer mechanism has a movable holding portion for holding the wafer at a position just above the wafer mounting portion and is constituted such that the movable holding portion moves up or down while avoiding the wafer held by the rotary mechanism.
Claims8
A pre-aligner apparatus comprises:
- a rotary mechanism configured to hold a semiconductor wafer and rotate the same, a detection mechanism configured to detect a positioning cutout portion formed in the wafer, and a wafer transfer mechanism configured to lift the wafer from a wafer mounting portion of the rotary mechanism or mount the wafer on the wafer mounting portion,
- wherein the wafer transfer mechanism includes a movable holding portion configured to hold the wafer at a position just above the wafer mounting portion, the wafer transfer mechanism being constituted such that the movable holding portion moves up or down while avoiding the wafer held by the rotary mechanism.
A pre-aligner apparatus comprises:
- a rotary mechanism configured to hold a semiconductor wafer and rotate the same, a detection mechanism configured to detect a positioning cutout portion formed in the wafer, and a wafer transfer mechanism configured to lift the wafer from a wafer mounting portion of the rotary mechanism,
- wherein the wafer transfer mechanism includes a movable holding portion configured to move up so as to abut against a rear face of the wafer when lifting the wafer, the wafer transfer mechanism being constituted such that the movable holding portion moves down while avoiding a next wafer held by the rotary mechanism after the wafer lifted by the movable holding portion has been carried out.
Dependencies are inferred from the claim text.