Photosensitive-resin remover composition and method of fabricating semiconductor device using the same

A photosensitive-resin remover composition, comprising:

• hydrazine hydrate in an amount of about 1% to about 3% by weight;
• a removing accelerator in an amount of about 1% to about 3% by weight;
• butyl diglycol in an amount of about 10% to about 40% by weight;
• and
• de-ionized water in an amount of about 70% to about 88% by weight,
• wherein a structure of the removing accelerator is represented by Formula 4,
• wherein n is an integer of 3 or 4, and each of R6 and R7 is independently hydrogen, a carboxylic group, a C1-4 alkoxy group, a C1-4 alkyl group, or a C1-4 alkyl alcohol group.