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US 2011/0217911 A1Published application
Polishing pad for chemical mechanical polishing process and chemical mechanical polishing apparatus including the same
AssigneeSamsung Electronics Co., Ltd.
InventorsOne-Moon CHANG, Jae-Phil Boo, Soo-Young Tak, Jong-Sun Ahn, Shin Kim, Kyoung-Moon Kang
Life of this patent
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Abstract
A chemical mechanical polishing apparatus includes a platen configured to support and rotate a wafer, and a polishing pad facing the platen. The polishing pad includes a body having a groove with a rotational symmetric pattern.
Claims20
A polishing pad for a chemical mechanical polishing process, the polishing pad comprising:
- a body having a groove with a rotational symmetric pattern.
A chemical mechanical polishing apparatus, comprising:
- a platen configured to support and rotate a wafer;
- and
- a polishing pad facing the platen and including a body having a groove with a rotational symmetric pattern.
Dependencies are inferred from the claim text.