Chemical mechanical polishing apparatus
AssigneeSamsung Electronics Co., Ltd.
InventorsOne-Moon CHANG, Jae-Phil Boo, Jong-Bok Kim, Soo-Young Tak, Jong-Sun Ahn, Shin Kim
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Abstract
A chemical mechanical polishing apparatus includes a platen having a first region configured to support a wafer, and a second region disposed outside the first region. The chemical mechanical polishing apparatus further includes a polishing pad disposed on the platen, a pad head to which the polishing pad is attached, a slurry supply configured to supply a slurry onto the wafer, and an injection port disposing on the second region of the platen. The injection port is configured to inject a predetermined gas to an edge of a bottom surface of the wafer and toward the outside of the wafer.
Claims20
A chemical mechanical polishing apparatus, comprising:
- a platen having a first region configured to support a wafer and a second region disposed outside the first region;
- a polishing pad disposed on the platen;
- a pad head to which the polishing pad is attached;
- a slurry supply configured to supply a slurry onto the wafer;
- and
- an injection port disposed at the second region of the platen, and configured to inject a predetermined gas to an edge of a bottom surface of the wafer and toward the outside of the wafer.
A chemical mechanical polishing apparatus, comprising:
- a platen configured to support a wafer;
- a polishing pad disposed on the platen;
- a pad head to which the polishing pad is attached;
- a slurry supply configured to supply a slurry onto a top surface of the wafer;
- and
- an injector configured to inject a predetermined gas to an edge of a bottom surface of the wafer and toward the outside of the wafer.
Dependencies are inferred from the claim text.