Connecting pad producing method
AssigneeOMRON Corporation
InventorsNaoto Kuratani, Kazuyuki Ono, Tomofumi Maekawa
Life of this patent
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Abstract
A connecting pad producing method has a first process of projecting an insulating member in a surface of a base material such that a region where a connecting pad is formed is surrounded, a second process of forming a conductive layer in the surface of the base material such that the insulating member is coated with the conductive layer, and a third process of removing the conductive layer with which the insulating member is coated, exposing the insulating member over a whole periphery from the conductive layer, and forming the connecting pad including the conductive layer in a region surrounded by the insulating member.
Claims10
A connecting pad producing method comprising:
- a first process of projecting an insulating member in a surface of a base material such that a region where a connecting pad is formed is surrounded;
- a second process of forming a conductive layer in the surface of the base material such that the insulating member is coated with the conductive layer;
- and
- a third process of removing the conductive layer with which the insulating member is coated, exposing the insulating member over a whole periphery from the conductive layer, and forming the connecting pad including the conductive layer in a region surrounded by the insulating member.
Dependencies are inferred from the claim text.