Method of fabricating semiconductor device
AssigneeElpida Memory, Inc.
InventorShinichi SAKURADA
Life of this patent
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Abstract
A method of fabricating a semiconductor device according to one embodiment includes preparing a wafer having a plurality of chip areas, each chip area to become semiconductor chip, bonding the first side of the wafer to a support substrate through a removable adhesive, dividing the wafer into individually separate semiconductor chips, applying adhesive tape to the second side of the separate semiconductor chips, the second side being opposite to the first side bonded to the support substrate, and the adhesive tape being softer than the support substrate, removing the support substrate from the semiconductor chips, and picking up the separate semiconductor chips that are on the adhesive tape.
Claims14
A method of fabricating a semiconductor device, comprising:
- preparing a wafer having a plurality of chip areas, each chip area to become semiconductor chip;
- bonding a first side of said wafer to a support substrate through a removable adhesive;
- dividing said wafer into individually separate semiconductor chips;
- applying adhesive tape to a second side of said separate semiconductor chips, said second side being opposite to said first side bonded to said support substrate, and said adhesive tape being softer than said support substrate;
- removing said support substrate from said semiconductor chips;
- and
- picking up said separate semiconductor chips on said adhesive tape.
A method of fabricating a semiconductor device, comprising:
- preparing a wafer having a plurality of chip areas, each chip area to become semiconductor chip;
- forming a predetermined circuit and a plurality of surface electrodes on a first side of said wafer in each of the plurality of said chip areas;
- bonding said first side of said wafer to a support substrate through a removable adhesive;
- forming a conductor and a back electrode, from a second side of said wafer, said conductor being penetrated through said wafer and electrically connected to said surface electrode, said back electrode being electrically connected to said conductor, and said second side being opposite to said first side;
- dividing said wafer into individually separate semiconductor chips;
- applying adhesive tape to said second side of said separate semiconductor chips, said second side being opposite to said first side bonded to said support substrate, and said adhesive tape being softer than said support substrate;
- removing said support substrate from said semiconductor chips;
- and
- picking up said separate semiconductor chips that are on said adhesive tape.
A method of manufacturing a semiconductor device, comprising:
- preparing a semiconductor wafer including a plurality of semiconductor chip therein, the semiconductor chips being defined by dicing lines, each of the semiconductor chips including a plurality of upper electrodes on side of a first surface of the semiconductor wafer;
- bonding the first surface of the semiconductor wafer to a support substrate;
- forming a plurality of lower electrodes on a second surface of the semiconductor wafer that is opposite to the first surface, each of the lower electrodes being electrically connected to the upper electrodes;
- dicing the semiconductor wafer along the dicing lines to separate the semiconductor chips from one another;
- applying a tape on the second surface of the semiconductor wafer after the dicing;
- removing the support substrate from the semiconductor wafer applied with the tape;
- and
- picking up the semiconductor chips from the tape.
Dependencies are inferred from the claim text.