Method for singulating electronic components from a substrate

A method for forming electronic assemblies comprising:

• providing electronic components within a device panel;
• attaching the device panel to a carrier substrate using an adhesive material, the carrier substrate having a plurality of openings therethrough;
• forming a plurality of cuts through the device panel to divide the device panel into a plurality of device panel portions, each device panel portion comprising at least one of the electronic components and being aligned with one of the openings through the carrier substrate;
• and
• inserting at least one ejection member through openings in the carrier substrate from a side opposite the device panel to lift the plurality of device panel portions from the carrier substrate.

A method for forming microelectronic assemblies comprising:

• encapsulating a plurality of microelectronic die in an encapsulation material to form a device panel, each of the plurality of microelectronic die having an integrated circuit formed thereon and having a die width;
• attaching the device panel to a carrier substrate using an adhesive material, the carrier substrate having a plurality of openings therethrough;
• forming a plurality of cuts through the device panel to divide the device panel into a plurality of device panel portions, each of the plurality of device panel portions comprising at least one of the plurality of microelectronic die, being aligned with one of the plurality of openings through the carrier substrate, and having a portion width that is greater than the die width and the plurality of cuts extending completely through the device panel and partially into the adhesive material;
• and
• inserting at least one ejection member through openings in the carrier substrate from a side opposite the device panel to remove the plurality of device panel portions from the carrier substrate.