Thermally activated micromirror and fabrication method
AssigneeEcole Polytechnique Federale De Lausanne (Epfl)
InventorsNicolas Abele, Faouzi Khechana, Philippe Renaud
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AssigneeEcole Polytechnique Federale De Lausanne (Epfl)
InventorsNicolas Abele, Faouzi Khechana, Philippe Renaud
Estimating the term…
A method for fabricating a micromirror in a wafer, including the steps of: depositing and etching layers forming two arms; etching the wafer such that in the back face only a thin portion of the wafer remains in the region of formation of the micromirror and the arms; performing an anisotropic etch, such that the thin portion remains only in the areas of the micromirror and the arms; and performing an isotropic etch to remove the thin portions under the arms, the etching step for forming the arms being performed following their shape and so as to form holes traversing the arms, the holes being positioned at edges of the region separating the micromirror and the wafer on both the side of the micromirror and the side of the portions of the wafer remaining after the anisotropic etching step. The invention also concerns the micromirror.
A method for fabricating, in a monocrystalline silicon wafer, a micromirror linked by at least two thermally deformable arms, comprising the steps of:
A micromirror linked by at least two thermally deformable arms to a monocrystalline silicon wafer, each arm having a plurality of traversing holes at locations at the edges of the region separating the micromirror and the wafer on the side of the micromirror and on the side of the wafer, the traversing holes having a diameter less than the width of the arms.
The micromirror according to 6, wherein the micromirror comprises a network of parallel lines.
A bar code reader comprising at least one micromirror, said micromirror being linked by at least two thermally deformable arms to a monocrystalline silicon wafer, each arm having a plurality of traversing holes at locations at the edges of the region separating the micromirror and the wafer on the side of the micromirror and on the side of the wafer, the traversing holes having a diameter less than the width of the arms.
A spectrometer comprising at least one micromirror, said micromirror being linked by at least two thermally deformable arms to a monocrystalline silicon wafer, each arm having a plurality of traversing holes at locations at the edges of the region separating the micromirror and the wafer on the side of the micromirror and on the side of the wafer, the traversing holes having a diameter less than the width of the arms.
Dependencies are inferred from the claim text.